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MEIKO Mechatronics Division Industrial Systems Equipment Department Business Introduction

MEIKO Mechatronics Division Industrial Systems Equipment Department Business Introduction

We have development bases globally! We have a proven track record of external sales of numerous electronic circuit board manufacturing equipment!

MEIKO's mechatronics business has over 40 years of experience in equipment development and a wealth of sales achievements. We address various challenges such as problems and defects that arise on-site, fulfilling your requests with our global FA system development framework. Additionally, we handle soldering robots and respond to various requests such as automation and inline integration in conjunction with FA systems. 【SR System Products】 ■LETHER-TOP ■LETHER-α *For more details, please refer to the PDF document or feel free to contact us.

  • Soldering Equipment
  • Other painting machines
  • Other conveying machines

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The quality of back fillet is unrelated to the amount of solder.

The quality of back fillet is unrelated to the amount of solder.

Focusing on the 'optimal timing'! Also able to handle back fillets for through holes without any issues.

In industry common sense, it is considered better to increase the amount of solder to secure the back fillet of through holes. However, in our view, the amount of solder is not the issue; rather, it is necessary to create a condition where solder can easily flow into the through holes as a prerequisite. Specifically, it is essential to quickly introduce flux into the through holes before flowing the solder, and if this is not done, no matter how much solder is supplied later, an appropriate back fillet cannot be formed. If the importance of flux is overlooked, one may conclude that "the amount of solder is not adequate (insufficient)." Our robots focus on the "optimal timing" to make the most of the flux, allowing for proper handling of back fillets in through holes without any issues. *For more details, please refer to the PDF materials or feel free to contact us.*

  • Soldering Equipment

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[Meiko Theory 3] V-slit is not recommended as a countermeasure against solder balls.

[Meiko Theory 3] V-slit is not recommended as a countermeasure against solder balls.

The reasons for occurrence are diverse! A stable supply speed is achieved through the supply of wire solder.

In the industry, it is commonly understood that methods such as V-slit processing, hole drilling, and preheating for wire solder are effective for reducing solder balls, and these are actively proposed to users. However, in our view, the above measures cannot completely eliminate solder balls and may significantly impair the soldering process itself, so we do not make such proposals. The reasons for the occurrence of solder balls are diverse, and one example of the generation principle is that solder can scatter and form solder balls due to the explosive phenomenon of moisture-absorbing impurities present in the flux components. One of the causes of the flux explosion phenomenon is the rapid temperature rise of wire solder due to the high temperature of the soldering iron tip. Therefore, by using a double motor for the supply of wire solder, we have achieved a stable supply speed, resulting in certain success in preventing the explosion phenomenon. *For more details, please refer to the PDF document or feel free to contact us.*

  • Soldering Equipment

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The cause of red-eye defects is not the misalignment of the soldering iron tip.

The cause of red-eye defects is not the misalignment of the soldering iron tip.

Proving that the misalignment of the position where the tip of the tool touches is not the direct cause!

In the industry, it is commonly believed that the cause of "pad red eye defects" is due to misalignment of the soldering iron tip position. However, our perspective is completely opposite to that notion. This is because, in manual soldering performed by operators, the position of the soldering iron tip varies slightly each time, yet red eye defects do not occur. This proves that misalignment of the soldering iron tip position is not the direct cause. The cause of red eye defects is that insufficiently performing robots are unable to achieve soldering at the "optimal timing," resulting in inadequate solder wetting. *For more details, please refer to the PDF materials or feel free to contact us.*

  • Soldering Equipment

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The heating time and quality by the tip of the soldering iron do not correlate proportionally.

The heating time and quality by the tip of the soldering iron do not correlate proportionally.

By achieving "good timing" in soldering, a contrasting positive cycle will be created!

In industry common sense, it is believed that the length of time the tip is in contact (heating time) is proportional to the stability of soldering. However, in our view, the above is an idea caused by "poor timing" in soldering. In other words, as a result of the reduced effectiveness of the flux, the wetting of the solder becomes slower, leading to a negative process where heating must continue during that time. On the other hand, if "good timing" in soldering is achieved, a contrasting positive cycle (balancing tact and quality) will emerge. *For more details, please refer to the PDF document or feel free to contact us.*

  • Soldering Equipment

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Meiko's True Theory 2: Nitrogen should not be utilized unconditionally.

Meiko's True Theory 2: Nitrogen should not be utilized unconditionally.

Nitrogen does not have a reducing effect like flux! There is a risk of an unbalanced state occurring.

In industry common sense, using nitrogen gas in soldering is considered beneficial for improving solderability. However, in our view, the advantages of nitrogen can be sufficiently obtained from the flux within the solder wire, and there are also quality control disadvantages associated with nitrogen, so we do not make any recommendations regarding its use. Nitrogen is commonly used in the reflow process, and its effects have been confirmed. The reason for its use is to suppress the oxidation of cream solder, but what about its effects in robotic soldering (subsequent processes)? In conclusion, since nitrogen does not have a reducing effect like flux, there is a risk of creating an unbalanced state in the fillet appearance and solder wetting (joint surface). Without relying on nitrogen at an increased cost, pursuing the "appropriate timing" and maximizing the use of the flux (reducing power) within the solder wire can enable high-quality soldering. *For more details, please refer to the PDF document or feel free to contact us.

  • Soldering Equipment

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